| Title |
Banded Structure in Rapid Solidification |
| Authors |
김성균(Seong Gyoon Kim); 최회진(Hoi Jin Choi); 김동익(Dong Ik Kim); 나형용(Hyung Yong Ra) |
| Abstract |
The microstructural evolutions during the transition between the supersaturated solid solution and the solutal dendrite in rapid solidification were qualitatively examined using the model of banded structure formation proposed by Carrard et al., It was shown that the positive average temperature gradient at solid-liquid interface is a necessary condition for the banded structure formation, and the banded structure can not be formed during rapid undercooled solidification. Also, it was shown that the banded structure is hardly anticipated in melt-spun aluminum alloy and, on the other hand, it can be formed at the free surface side of the melt-spun Ag-Cu alloy ribbons. These predictions are in good agreement with the reported experimental results on banded structure formation. |