| Title |
A Study on the Microstructure and Crystallographic Orientation of Cu Electrodeposit using EBSD method |
| Authors |
최창희(Chang Hee Choi); 남효승(Hyo Seung Nam); 정재한(Jae Han Jeong); 이동녕(Dong Nyung Lee) |
| Keywords |
EBSD; Cu electrodeposit; Texture; twin |
| Abstract |
The structure and texture of copper electrodeposits have been studied in a macro/microscopic viewpoint. The copper specimens composed by three different kinds of fibre texture, namely, near random, (110) and (111) have been obtained at various deposition conditions. The macro/microtexture have been investigated by X-ray and EBSD in SEM, respectively. The crystallographic orientation of each grain of copper electrodeposits could be roughly estimated using crystallographic etch pit method and it was compared with the results measured from EBSD. The through thickness orientation variation was also investigated using EBSD technique in SEM. The twin distribution and its density could be well characterized through this method. |