| Title |
Effect of Si Oxide Interlayer on the Scale Adhesion of 19Cr-Ti Ferritic Stainless Steel |
| Authors |
박수호(Soo Ho Park) ; 이윤용(Yun Yong Lee) ; 이용득(Yong Deuk Lee) ; 류두형(Du Hyung Ryu) |
| Abstract |
The effect of Si addition on the scale adhesion of 19Cr-Ti ferritic stainless steel, which is used for stud pin as a sealing material for cathode ray tube, has been studied by using press compression test, visual inspection, optical micrograph and electronic microanalysis. A spalling behavior of scale formed on the surface by oxidation treatment at 1100℃ for 30∼40 minutes in 75%H₂+25%N₂ gas mixtures was mainly governed by the morphology of SiO₂ layer formed at scale/metal interface. As Si content exceeded more than 0.5%, a continuous silica interlayer was produced and then the adhesion of scale which is mainly 2∼4㎛ thickness of Cr-oxide layer was abruptly decreased. It is due to a low fracture toughness of SiO₂ formed at scale/metal interface and a generation of residual stress at scale/metal interface during cooling after oxidation treatment. The residual stress might originate from a great discrepancy in thermal expansion coefficient between matrix and silica. |