| Title |
Research Paper / Welfing & Joining : Microstucture and Bonding strength of Ti / Al Joints Bonded by Diffusion Bonding method |
| Authors |
이태원(Tae Won Lee); 김인겸(In Kyum Kim); 이지환(Chi Hwan Lee) |
| Abstract |
The main objective of this study is to investigate the bonding strength and the microstructure of Ti/Al joints bonded by diffusion bonding method. The bonding of Ti/A1 was performed at the temperature range of 560-630℃ for 3-300min under bonding pressure of 1㎫ in vacuum atmosphere. The intermetallic compound, Al₃Ti, was found to be formed into the titanium side at the Ti/Al interface. The thickness of Al₃Ti layer was increased almost linearly with increasing bonding time up to about 10㎛. Bonding strength increased with increasing bonding time up to 60min at 600℃ The thickness of Al₃Ti layer was about 4㎛ at 600℃/60min. However, bonding strength showed a equal value(100㎫) at the bonding time range of 60-300min at 600℃. The Ti/Al joints were fractured at the interface of Al/Al₃Ti layer in all bonding conditions, no fracture was observed in Al₃Ti layer. Particularly, the Ti/Al joints bonded for more than 60min at 600℃ were fractured at the aluminium base metal. Therefore, it is considered that bonding strength was not dependent upon thickness of Al₃Ti layer(4-10㎛) because of Ti/Al joints were fractured at the interface of Al/Al₃Ti layer regardless of Al₃Ti layer thickness. |