| Title |
Research Paper / Electronic , Magnetic & Optical Materials : Characteristics of Composite Solder Balls produced by in - situ Processing Part 1: Effects of processing variables on the microstructures of in - situ Sn-Ag composite solders |
| Authors |
허정나(Jung Na Heo); 이종현(Jong Hyun Lee); 박대진(Dea Jin Park); 김석윤(Suk Yoon Kim); 신동혁(Dong Hyuk Shin); 김유석(Yong Seog Kim) |
| Abstract |
In this study, an attempt was made to develop an in-situ processing method of Sn-Ag composite solders for the ball grid array in electronic packaging applications. The reinforcing phase(Cu_6Sn_5) was produced by the reaction between Sn in the matrix and Cu powders added. It was found that the shape and size of the phase formed are affected by the processing parameters such as holding time very sensitively. The mechanical properties and the thermal stability of the composite solders were proved to be superior to those of Sn-3.5 %Ag solder. |