| Title |
Characteristics of Composite Solder Balls Produced by an in - situ Processing Part 2 : Reflow Solderability of the Sn - Ag in - situ Composite Solder ball |
| Authors |
허정나(Jung Na Heo),이종현(Jong Hyun Lee),박대진(Dae Jin Park),김석윤(Suk Yun Kim),신동혁(Dong Hyuk Shin),김용석(Yong Seog Kim) |
| Abstract |
In this study, the solderability of the in-situ composite solders was investigated by reflow soldering the solder balls on a BT substrate. The reaction characteristics of the composite solders were evaluated by observing the microstructure of the solder/BLM interface. Also the effects of the number of reflow soldering on the microstructure and the distribution of the reinforcement were investigated. These results indicated that the composite solder has a lower reactivity with the BLM and Cu, but its thermal stability must be improved significantly for actual applications of the material. |