| Title |
Growth Kinetics and Growth Suppression of Au - containing Ternary Intermetallic at Solder / UBM Interface during Solid Aging |
| Authors |
이종현(Jong Hyun Lee),최병도(Boung Do Choi),이용호(Yong Ho Lee),김용석(Yong Seog Kim) |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Abstract |
In this study, effects of under bump metallurgy (UBM) structure and Cu content in solders on redeposition rate of Au-containing ternary intermetallics at solder/UBM interface were investigated. A UBM structure with Ni diffusion barrier, Au/Ni/Cu, appeared to promote the redeposition during solid state aging treatment, leading to an Au-embrittlement of solder interconnections. Addition of Cu into eutectic Sn-Pb and Sn-Ag solders, however, were observed to be very effective in retarding the redeposition and preventing the Au-embrittlement. These effects were discussed with the microstructures observed. |