| Title |
Mechanical Behaviors : Evaluation of Thin Film residual Stress through the Nanoindentation Technique and the Modeling of Stress Relaxation |
| Authors |
이윤희(Yun Hee Lee),최열(Yeol Choi),권동일(Dong Il Kwon) |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Abstract |
Residual stress in thin film was evaluated by a nanoindentation technique combined with a new stressrelaxation model. The dominant shape change in the nanoindentation curve during the stress relief in thin film was identified as the increase or decrease of applied load for a given maximum indentation depth. The applied indentation load of film under tensile stress was higher than that of stress-free film. Also, a stress-sensitive deformation morphology around the indenter-thin film contact was proposed. Finally, the in-plane residual stress in thin film was directly calculated from the change in the normal applied load arising from stress relaxation. The stresses for diamond-like carbon (DLC) and Au films evaluated under the proposed analytical model agreed well with the residual stresses measured by the conventional curvature method. |