| Title |
Welding & Joining : A Study on the Formation and Growth Behavior of Microconstituents in Transient Liquid Phase Bonded Joints |
| Authors |
김대업(Dae Up Kim),정승부(Seung Boo Jung) |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Abstract |
The formation, growth and disappearance behaviors of microconstituents in the bonded region of Ni-base single superalloy, CMSX-2 during transient liquid phase (TLP) bonding was investigated employing MBF-80 insert metal. TLP-bonding was carried out at 1373∼1548 K for 0∼19.6 ks in vacuum of 4 mPa. The (100) orientation of each test specimen was always aligned perpendicular to the bonding interface. Borides were formed in the bonded layer during TLP-bonding operation. In the early stage of bonding, base metal dissolution process, small and lots of microconstituents come into being, and the microconstituents combine and grew as the bonding temperature increased and the holding time was increased. The amount of microconstituents in the bonded layer after isothermal solidification was decreased with the holding time. The microconstituents in the bonded layer disappeared at the bonding condition of 1523 K×1.8 ks. |