The Journal of
the Korean Journal of Metals and Materials

The Journal of
the Korean Journal of Metals and Materials

Monthly
  • pISSN : 1738-8228
  • eISSN : 2288-8241

Editorial Office

Title Electronic , Magnetic & Optical Materials : Structural and Electrical Properties of Porous Silicon with Deposited Cu Films
Authors 홍광표(Kwang Pyo Hong),이종무(Chong Mu Lee)
Page pp.1318-1323
ISSN 1738-8228(ISSN), 2288-8241(eISSN)
Abstract Thin Semi-transparent Cu films were deposited at room temperature, using rf-sputtering on porous silicon (PS). The porous layer with the thickness of about 15-17 ㎛ were obtained on p-type (100) silicon wafers, by applying various current densities viz. 25, 45, 65 and 85 ㎃/㎠. Various thicknesses of Cu films ranging from 45 to 170 Å were obtained by varying sputtering time. The red shift from 620 to 750 ㎚ was observed in PL peaks for the copper deposited PS. To analyze the surface morphology of the films scanning electron microscopy (SEM) and atomic force microscopy (AFM) analyses of the films were carried out. The surface roughness of Cu films as measured from AFM varies from 0.669 to 1.8575 ㎚. The refractive index of the films measured by ellipsometry, varies from 1.38 to 1.95 with increasing Cu film thickness. The I-V characteristics show the shift of the barrier from 0.65 to 0.77 eV with decreasing the etching current density from 85 to 25 ㎃/㎠.