| Title |
Welding & Joining : The Properties of Sn - 57 wt. % Bi - 0.5 wt.& Zn Solder / Cu Joint with Aging Treatment |
| Authors |
오주석(Ju Seok Oh),이도재(Doh Jae Lee),조규종(Kyu Zong Cho),이경구(Kyung Ku Lee) |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Abstract |
The shear strength and creep properties of Sn-57 wt.%Bi/Cu and Sn-57 wt.%Bi-0.5 wt.%Zn/Cu joints were studied. Modified double lap shear solder joints were aged for 60 days at 80℃ and then loaded to failure in shear. The shear strength of solder/Cu joints was decreased with aging treatment and the rapid decrease in shear strength of the Sn-57 wt.%Bi/Cu joint was appeared in the 60 days aged specimen. The crack path of aged solder/Cu joint were changed from through the solder to through the interface between Cu substrate and reaction layer with Zn addition. But the crack path under creep test was through the solder regardless of Zn addition. |