| Title |
Electrochemical Reliability of Plasma-Polymerized Thiophene Films in Microelectronic Devices |
| Authors |
김정구(Jung Gu Kim); 박진택(Zin Taek Park); 최윤석(Yoon Seok Choi); 부진효(Jin Hyo Boo); 유용재(Yong Jae Yu) |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Keywords |
Corrosion; Plasma enhanced chemical vapor deposition; PECVD; Thiophene film |
| Abstract |
The corrosion failure of electronic devices has been a major reliability concern lately. This failure is an ongoing concern because of miniaturization of integrated circuits(IC) and the increased use of polymers in electronic packaging. In this paper plasma-polymerized thiophene films were considered as a possible candidate for an interlayer dielectric for multilever metallization of ultra large scale integrated (ULSI) semiconductor devices. The protective ability of above films as a function RF power in an 3.5 wt.% NaCl solution was examined by electrochemical methods and contact angle measurement. The protective efficiency of the film increased with increasing RF power, which induced the higher degree of cross-linking and hydrophobicity of the films. |