| Title |
Determination of Flow Curve for Flip-chip Solder Balls Based on FE Modeling of Thermal Displacements Measured by ESPI |
| Authors |
이백우(Baik Woo Lee); 김주영(Ju Young Kim); 나재웅(Jae Woong Nah); 백경욱(Kyung Wook Paik); 권동일(Dong Il Kwon) |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Keywords |
Flip-chip; Electronic speckle pattern interferometry; ESPI; Finite element modeling; FEM; Flow curve; Bulk solder; Reliability |
| Abstract |
The goal of this study was to determine the uniaxial flow curve for solder balls in a flip-chip from experimental-computational algorithms based on finite element modeling (FEM) of in-plane thermal displacement data measured by electronic speckle pattern interferometry (ESPI). In order to measure the deformation of such tiny components as the solder balls in the flip-chip, the spatial resolution of ESPI was increased to submicron scale by magnifying the areas studied. The flow curve for solder balls in the flip-chip was determined by the algorithm, which effectively matches the simulated solder deformation by FEM to the measured deformation by ESPI. The algorithms were applied to Sn-36Pb-2Ag flip-chip solder balls. The flow curve obtained for flip-chip solder was compared with those for bulk solder. The microstructure was also studied to clarify the flow curve results. |