| Title |
The Effect of Wafer Back-Grinding Process on Flexural Strength of Semiconductor Chips |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Keywords |
Silicon chip; Stress; Grinding mark; Dimension; Fracture |
| Abstract |
As portable electronic products become more prevalent, their susceptibility to mechanical damage increases. In the present work, it is studied how the fracture strength of bare silicon chips is influenced by manipulating grinding mark geometry or chip dimension. It was experimentally investigated how a decrease in chip thickness from 360 μm to 240 μm influences the flexural strength of bare chips. The experimental results showed that when chip thickness was decreased to 30%, the flexural strength of the bare chips could be decreased by 2-fold. However, it was found that reducing the depth of scratches (or grooves) on the chip back surface from 1 pm to 0.1 pm, which result from the wafer back-grinding process, could compensate for a decrease in flexural strength due to chip thickness reduction. (Received October 21, 2004) |