| Title |
An Integrated Multimode Interference Optical Waveguide Isolator Fabricated by Wafer Direct Bonding Technology |
| Authors |
노종욱(J. W. Roh); 양정수(J. S. Yang); 이우영(W. Y. Lee); 옥성해(S. H. Ok); 우덕하(D. H. Woo); 변영태(Y. T. Byun); 전영민(Y. M. Jhon); 이석(S. Lee) |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Keywords |
Optical isolator; Wafer direct bonding; Magneto-optic; Mutimode interference; Garnet |
| Abstract |
An integrated optical isolator based on multimode interference (MMI) has been studied. Wafer direct bonding technology was used in order to make an integrated optical isolator. Prior to making a direct bonding between Ce : YIG(CeY2Fe5O12) thin film cladding layer and InGaAsP guiding layer, wafer direct bonding between (100)-oriented InP and (111)-oriented GGG(Gd3Ga5O12) was investigated. We found that wafer direct bonding between (100)-oriented InP and (111)-oriented GGG was successfully achieved and effective for the integration of a waveguide optical isolator. In order to accomplish direct bonding between Ce : YIG thin film cladding layer and InGaAsP guiding layer for fabrication of an integrated optical waveguide isolator, the same process has been adopted. The isolation ratio in our device was found to be 2.9 dB at the wavelength of 1.55 μm. |