| Title |
The Effect of Arabic Gum and Chloride Ion on the Nucleation and Growth of Copper During Electrodeposition |
| Authors |
우태규(Tae Gyu Woo); 설경원(Kyeong Won Seol); 이현우(Hyun Woo Lee); 박일송(Il Song Park); 오동진(Dong Jin Oh); 권오종(O Jong Kwon) |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Keywords |
Electrodeposition; Arabic gum; Chloride ion; Nucleation; Copper foil |
| Abstract |
The purpose of this study is to identify the effect of additives amount and composition rate on initial copper nucleation and growth during copper electrodeposition. Additives such as arabic gum, chloride ion were used in this study. In the production of electrodeposited copper foil, the surface roughness and crystal size of copper was able to be controlled by using appropriate combination of additives. Among various electrodeposition conditions, the minimum surface roughness of copper foil was obtained when electrodeposited at the current density of 500 mA/㎠ for 50 seconds with 1.5 ppm of gum arabic and 15 ppm of chloride ion. The minimum value of surface roughness was 0.195 ㎛. The addition of chloride ions (5 ppm~20 ppm) showed more effect on reducing the surface roughness compared with the case adding gum arabic only in the electrolyte. |