| Title |
Thermal Stability of Electrodeposited Ni-Re-P Diffusion Barrier for Cu Interconnecion |
| Authors |
강성군(Sung Goon Kang); 조진기(Jin Ki Cho); 김문태(Moon Tae Kim) |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Keywords |
diffusion barrier; Cu diffusion; thermal stability; Ni-P electrodeposition; Ni-Re-P electrodeposition |
| Abstract |
Using electrodeposition, the influence of Re on thermal stability of Ni-P films was studied. Ni-P and Ni-Re-P films were electrodeposited on Cu plates in a sulfamate bath respectively. Electrodeposition was carried out at 1A/dm2 and the film`s thickness was 170nm. The concentration of P and Re in the films was analyzed by WDXRF(Wave Dispersive X-ray Fluorescence Spectrometers) and the concentration was 6wt.% and 10wt.% respectively. DSC(Differential Scanning Calorimetry) and XRD(X-ray diffraction) showed that the crystallization temperature of Ni-Re-P films was 76℃ higher than that of Ni-P films. The results indicated that the thermal stability of Ni-Re-P films was superior to that of Ni-P films. |