| Title |
Effect of Temperature/Humidity Treatment Conditions on the Interfacial Adhesion Energy of Inkjet Printed Ag Film on Polyimide |
| Authors |
박성철(Sung Cheol Park); 조수환(Su Hwan Cho); 정현철(Hyun Cheol Jung); 정재우(Jae Woo Joung); 박영배(Young Bae Park) |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Keywords |
adhesion; temperature/humidity; peel test; inkjet printed ag; polyimide |
| Abstract |
Effects of 85℃/85%RH(T/H) treatment conditions on the interfacial fracture energy of inkjet printed Ag/Polyimide system are investigated from 180° peel test by calculating the peeling deformation energy of peeled metal and polyimide films. Interfacial fracture energy between inkjet printed Ag and polyimide was initially around 28.0 g/mm, while the increase in T/H treatment times as 76, 196, and 388 hrs lead to initial increase up to 78.9 g/mm and then decrease to 56.4 and 44.3 g/mm, respectively. Ag-O-C bonding formation seems to be responsible for interfacial adhesion improvement in the initial T/H treatment while moisture penetration inside polyimide itself seems to be related to the decrease in interfacial adhesion for longer T/H conditions. |