| Title |
The Effect of Anodic Oxidation Condition of Titanium Substrate on the Surface Morphology and Crystal Structure of Electrodeposited Copper |
| Authors |
박은광(Eun Kwang Park); 이만형(Man Hyung Lee); 설경원(Kyeong Won Seol); 우태규(Tae Gyu Woo); 박일송(Il Song Park) |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Keywords |
electrodeposition; copper foil; titanium anodizing; TiO2 |
| Abstract |
Recently, requirerr ent for the ultra thin copper foil increase with smaller and miniaturized electronic components. A study has been made to determine the effect of an electrochemically produced titanium-oxide film on the surface morphology and crystal structure of copper. The oxide films were made current step and potential step at 20℃ in 1.5M sulfuric acid on pure titanium metal. The formation of a microporous oxide layer enhances the surface morphology of copper foil. When a copper foil was electroplated on the polished titanium surface, large particles were existed on the surface of the copper film deposited. However, a smooth surface was obtained when the 130V anodized surface was used. The minimum value of surface roughness(Ra) was 0.254μm. |