| Title |
Effect of Under Bump Metallization (UBM) on Interfacial Reaction and Shear Strength of Electroplated Pure Tin Solder Bump |
| Authors |
김유나(Yu Na Kim); 구자명(Ja Myeong Koo); 박선규(Sun Kyu Park); 정승부(Seung Boo Jung) |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Keywords |
Flip chip; pure tin (Sn); under bump metallization; UBM; multiple reflows; interfacial reaction; shear test; intermetallic compound; IMC |
| Abstract |
The interfacial reactions and shear strength of pure Sn solder bump were investigated with different under bump metallizations (UBMs) and reflow numbers. Two different UBMs were employed in this study: Cu and Ni. Cu6Sn5 and Cu3Sn intermetallic compounds (IMCs) were formed at the bump/Cu UBM interface, whereas only a Ni3Sn4 IMC was formed at the bump/Ni UBM interface. These IMCs grew with increasing reflow number. The growth of the Cu-Sn IMCs was faster than that of the Ni-Sn IMC. These interfacial reactions greatly affected the shear properties of the bumps. |