| Title |
Effect of Ion-beam Pre-treatment on the Interfacial Adhesion of Sputter-deposited Cu film on FR-4 Substrate |
| Authors |
민경진(Kyoung Jin Min); 박성철(Sung Cheol Park); 이기욱(Ki Wook Lee); 김재동(Jae Dong Kim); 김도근(Do Geun Kim); 이건환(Gun Hwan Lee); 박영배(Young Bae Park) |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Keywords |
adhesion; peel test; ion-beam pre-treatment; FR-4 substrate; sputter-deposited Cu |
| Abstract |
The effects of Ar/O2 ion-beam pre-treatment conditions on the interfacial adhesion energy of sputter-deposited Cu thin film to FR-4 substrate were systematically investigated in order to understand the interfacial bonding mechanism for practical application to advanced chip-in-substrate package systems. Measured peel strength increases from 45.8±5.7 g/mm to 61.3±2.4 g/mm by Ar/O2 ion-beam pre-treatment with anode voltage of 64 V. Interfacial bonding mechanism between sputter-deposited Cu film and FR-4 substrate seems to be dominated by chemical bonding effect rather than mechanical interlocking effect. It is found that chemical bonding intensity between carbon and oxygen at FR-4 surface increases due to Ar/O2 ion-beam pretreatment, which seems to be related to the strong adhesion energy between sputter-deposited Cu film and FR-4 substrate. |