| Title |
Effect of Temperature/Humidity Treatment Conditions on Interfacial Adhesion of Electroless-plated Ni on Polyimide |
| Authors |
민경진(Kyoung Jin Min); 정명혁(Myeong Hyeok Jeong); 이규환(Kyu Hwan Lee); 정용수(Yong Soo Jeong); 박영배(Young Bae Park) |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Keywords |
adhesion; temperature/humidity; peel test; alkali surface pretreatment; electroless-plated Ni; polyimide |
| Abstract |
Effects of 85℃/85% Temperature/Humidity (T/H) treatment conditions on the peel strength of an electroless-plated Ni/polyimide system were investigated from a 180° peel test. Peel strength between electroless-plated Ni and polyimide monotonically decreased from 37.4±5.6 g/mm to 22.0±2.7 g/mm for variation of T/H treatment time from 0 to 1000 hrs. The interfacial bonding mechanism between Ni and polyimide appears to be closely related to Ni-O bonding at the Ni/polyimide interface. The decrease in peel strength due to T/H treatment appears to be related to polyimide degradation due to moisture penetration through the interface and the bulk polyimide itself. |