| Title |
The Effects of Electrolyte Compositions on the Property of Copper Electrodeposited Layer |
| Authors |
박은광(Eun Kwang Park); 이만형(Man Hyung Lee); 우태규(Tae Gyu Woo); 박일송(Il Song Park); 정광희(Kwang Hee Jung); 설경원(Kyeong Won Seol) |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Keywords |
polyimide; electrodeposition; electrolyte; surface morphology; texture; peel strength |
| Abstract |
The purpose of this study is to identify the effect of electrolyte compositions on electrodeposited copper foil. First of all, the polyimide substrate was pretreated with plasma. Finally, copper foil was deposited on a Cu/Ni/Polyimide substrate using the electroplating technique. As the quantity of Cu increased, preferred orientations changed into (111). Increasing sulfuric acid, on the other hand, brought down the preferred orientation of (111). The lowest sheet resistance, surface roughness, and fine adhesion were detected when the ratio of Cu2+ and H2SO4 is 50:50(g/l). |