| Title |
Electroplating on Magnesium Alloy in KF-Added Pyrophosphate Copper Bath |
| Authors |
이정훈(Jung Hoon Lee); 김용환(Yong Hwan Kim); 정우창(Uoo Chang Jung); 정원섭(Won Sub Chung) |
| DOI |
https://doi.org/10.3365/KJMM.2010.48.03.218 |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Keywords |
thin film; deposition; electrochemistry; scanning electron microscopy; SEM; magnesium |
| Abstract |
Direct copper electroplating on Mg alloy AZ31B was carried out in a traditional pyrophosphate copper bath containing potassium fluoride. Electrochemical impedance spectroscopy and polarization methods were used to study the effects of added potassium fluoride on electrochemical behavior. The chemical state of magnesium alloy in the electroplating bath was analyzed by X-ray photoelectron spectroscopy. Adhesion of the copper electroplated layer was also tested. Due to the added potassium fluoride, a magnesium fluoride film was formed in the pyrophosphate copper bath. This fluoride film inhibits dissolution of Mg alloy and enables to electroplate copper directly on it. A dense copper layer was formed on the Mg alloy. Moreover, this copper layer has a good adhesion with Mg alloy substrate. |