| Title |
Microstructural Control of Al-Sn Alloy with Addition of Cu and Si |
| Authors |
손광석(Kwang Suk Son); 박태은(Tae Eun Park); 김진수(Jin Soo Kim); 강성민(Sung Min Kang); 김태환(Tae Hwan Kim); 김동규(Dong Gyu Kim) |
| DOI |
https://doi.org/10.3365/KJMM.2010.48.03.248 |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Keywords |
Al-Sn; alloys; casting; wear; electron backscattering |
| Abstract |
The effect of various alloying elements and melt treatment on the microstructural control of Al-Sn metallic bearing alloy was investigated. The thickness of tin film crystallized around primary aluminum decreased with the addition of 5% Cu in Al-Sn alloy, with tin particles being reduced in size by intervening the Ostwald ripening. With the addition of Si in Al-10%Sn alloy, the tin particles were crystallized with eutectic silicon, resulting in uniform distribution of tin particles. With the addition of Cu and Si in Al-Sn alloy, both the tensile strength and yield strength increased, with the increasing rate of yield strength being less than that of tensile strength. Although the Al-10%Sn-7%Si alloy has similar tensile strength compared with Al-10%Sn-5%Cu, the former showed superior abrasion resistance, resulting from preventing the tin particles from movement to the abrasion surface. |