| Title |
Effect of Electrolyte Compositions on the Physical Property and Surface Morphology of Copper Foil |
| Authors |
우태규(Tae Gyu Woo); 박일송(Il Song Park); 전우용(Woo Yong Jeon); 박은광(Eun Kwang Park); 정광희(Kwang Hee Jung); 이현우(Hyun Woo Lee); 이만형(Man Hyung Lee); 설경원(Kyeong Won Seo) |
| DOI |
https://doi.org/10.3365/KJMM.2010.48.10.951 |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Keywords |
Thin films; plating; mechanical properties; resistivity; Flexibility |
| Abstract |
This study examined the effect of copper and sulfuric acid concentrations on the surface morphology and physical properties of copper plated on a polyimide (PI) film. Electrochemical experiments with SEM and a four-point probe were performed to characterize the morphology and mechanical characteristics of copper electrodeposited in the composition of an electrolyte. The resistivity and peel strength were controlled using a range of electrolyte compositions. A lower resistivity and high flexibility were obtained when an electrolyte with 20 g/l of copper was used. However, a uniform surface was obtained when a high current density that exceeded 20 mA/cm² was applied, which was maintained at copper concentrations exceeding 40 g/l. Increasing sulfuric acid to >150 g/l decreased the peel strength and flexibility. The lowest resistivity and fine adhesion were detected at a Cu2+: H2SO4 ratio of 50:100 g/l. |