| Title |
Evaluation of the Cu Target Fabricated by the SPS Technique and its Sputtered Film |
| Authors |
현혜영(Hye Young Hyun); 김민정(Min Jung Kim); 유정호(Jung Ho Yoo); 양준모(Jun Mo Yang); 오익현(Ik Hyun Oh); 이승민(Seung Min Lee); 오용준(Yong Jun Oh) |
| DOI |
https://doi.org/10.3365/KJMM.2011.49.3.250 |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Keywords |
Cu target; sputtering film; spark plasma sintering; evaluation |
| Abstract |
The basic properties and electrical characteristics of sputtering films deposited with a commercial cast target and Spark Plasma Sintering (SPS) were compared and analyzed. From the results, the Cu film prepared heating 60℃/min (SPS process) showed a similar specific resistance compared to the commercial cast Cu film. Also, auording to the results of XRD, SIMS, and TEM. There was not much difference in the crystal structure and impurities between the two films. Consequently, the SPS Cu target was found to have quite similar properties with the commercial one and it is expected to be applied in futare research to the metal wiring material for semiconductor/display devices. |