| Title |
Effect of Shearing Speed and UBMs on High Speed Shear Properties of Sn3.0Ag0.5Cu Solder Ball |
| Authors |
정도현(Do Hyun Jung); 이왕구(Wang Gu Lee); 정재필(Jae Pil Jung) |
| DOI |
https://doi.org/10.3365/KJMM.2011.49.8.635 |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Keywords |
electrical/electronic materials; soldering; mechanical properties; scanning electron microscopy; SEM; high speed shear |
| Abstract |
The effect of high shear speed on shear force, shear energy and fracture surface was investigated for the solder joint of a Sn-3.0Ag-0.5Cu ball. For both ENIG and OSP pads, the shear force increased with an increase in shearing speed to 0.3 m/s. However, for an ENEPIG pad, the shear force increased with an increase in shear speed to 0.6 m/s and kept almost constant afterward. The shear energy decreased with an increase in shearing speed for ENIG and OSP pads. For the ENEPIG pad, however, the shear energy almost remained constant in a shearing speed range 0.3-3.0 m/s. The fracture mode analysis revealed that the amount of brittle fracture for the ENIG and the OSP pads increased with shearing speed, and a complete brittle fracture appeared at 1.0 m/s for ENIG and 2.0 m/s for OSP. However, the ENEPIG pad showed only a ductile fracture until 0.25 m/s, and a full brittle fracture didn`t occur up to 3.0 m/s. The fracture mode matched well with the shear energy. The results from the high speed shear test of SAC305 were similar to those of SAC105. |