| Title |
Influence of the STD61/S45C Substrate and added Si contenton the Die Soldering Behavior both Al and Iron |
| Authors |
김유미(Yu Mi Kim); 최세원(Se Weon Choi); 김영찬(Young Chan Kim); 강창석(Chang Seog Kang); 홍성길(Sung Kil Hong) |
| DOI |
https://doi.org/10.3365/KJMM.2014.52.5.353 |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Keywords |
soldering; intermetallics; defect; image analysis; aluminizing |
| Abstract |
Die soldering is one of common defect generating during the die casting process of aluminum alloys. Until now, the various researchers have been usually studied about die soldering phenomenon in relation to the aluminum components. However, the influence of the mold materials was rarely studied. So, in this study, we have carried out the die-soldering tests using both STD61 and S45C steel to confirm the effect of die materials on die-soldering. Each Aluminum alloys were melted and held at 680℃ and then STD61and S45C steel were dipped for 2hr in the aluminum melt. After dipping, the substrate was cooled in the air and analyzed using a SEM and EPMA. The result of soldering test, reaction layer of STD61 substrate has increased according to Si contents of aluminum, however, reaction layer thickness was deceased in the S45C substrate. |