| Title |
Effects of Cu-doping on the Power Factor of Bi0.42Sb1.58Te3 Thermoelectric Compounds Prepared by Hot Pressing |
| Authors |
임영수(Young Soo Lim); 송민석(Minseok Song); 이순일(Soonil Lee); 서원선(Won-seon Seo) |
| DOI |
https://doi.org/10.3365/KJMM.2017.55.6.427 |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Keywords |
thermoelectric; bismuth telluride; hot pressing; charge transport; power factor |
| Abstract |
We report the effects of incorporated Cu on the thermoelectric transport properties of Bi0.42Sb1.58Te3 compounds prepared by the hot pressing method. The hole concentration in the compound increased significantly with the increase in the Cu content. The acceptor role of Cu was manifested by Hall measurements and also by the temperature-dependent Seebeck coefficient. Mobility in the compound was mainly governed by phonon scattering, and was additionally affected by ionized impurity scattering. Density-of-state effective mass increased with the Cu content and its effects on the power factor were discussed.(Received October 4, 2016; Accepted December 22, 2016) |