| Title |
Effect of Sn Content on Filler and Bonding Characteristics of Active Metal Brazed Cu/Al2O3 Joint |
| Authors |
(Jioh Shin); (Ashutosh Sharma); (Do-hyun Jung); (Jae Pil Jung) |
| DOI |
https://doi.org/10.3365/KJMM.2018.56.5.366 |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Keywords |
metal; active brazing; diffusion; intermetallic compounds; alumina |
| Abstract |
This study examined the effects of the Sn content in a pure active metal filler Ag-Cu-Ti for the brazing of a Cu/ Al2O3 joint. The optimal content of Sn to effectively wet alumina was 5 wt%. The microstructure of the brazed joint showed the presence of an Ag-rich matrix and a Cu-rich phase, and Cu- Ti intermetallic compounds were observed along the bonded interface. The intermetallic compounds (IMCs) in the filler are found to increase when the Sn content in the alloy approaches to 10 wt%. These results suggest an extremely significant bonding strength of Cu/Al2O3 joint using the Ag-Cu-Ti+Sn filler. The shear strength of the brazed joint increased with Sn content up to 5 wt%, reaching a maximum at ?15 MPa. In addition, the strength decreased when the Sn content was higher than 5 wt%. |