The Journal of
the Korean Journal of Metals and Materials

The Journal of
the Korean Journal of Metals and Materials

Monthly
  • pISSN : 1738-8228
  • eISSN : 2288-8241

Editorial Office

Title Effects of Ni and Cu Addition on Tensile Properties and Thermal Conductivity of High Pressure Die-cast Al-6Si Alloys
Authors 장재철(Jae-cheol Jang); 신광선(Kwang Seon Shin)
DOI https://doi.org/10.3365/KJMM.2020.58.4.217
Page pp.217-226
ISSN 1738-8228(ISSN), 2288-8241(eISSN)
Keywords aluminum; high pressure die casting; thermal conductivity; thermodynamic calculation; alloy design
Abstract In this study, the effects of nickel and copper on the mechanical and thermal properties of Al-Si alloys were investigated, for different alloy compositions. Thermodynamic calculations were carried out to predict the alloys’ solidification behavior (solidification temperature, solid fraction and physical properties (density, thermal conductivity, elastic modulus, bulk modulus)). The aluminum alloys were produced by high pressure die-casting process with a 125 ton die-casting machine. Microstructures in the Al-Si-Ni alloys were characterized by optical microscopy and scanning electron microscopy. The mechanical properties were evaluated by tensile tests. Thermal conductivity was measured using a laser flash method. The addition of Ni and Cu improved the mechanical properties of the alloys by different strengthening mechanisms. Solution strengthening was the more effective method of improving mechanical properties, compared with strengthening by intermetallic compounds. The addition of an appropriate concentration of soluble alloying elements consistently improved alloy strength. However, addition of alloying elements decreased the thermal conductivity of the primary alpha aluminum phase. EDS analysis confirmed that soluble alloying elements like Cu not only can form intermetallic compounds, but can also change other kinds of compounds. Accordingly, careful consideration should be given to the chemical composition of soluble/insoluble alloying elements when attempting to improve mechanical properties and thermal conductivity at the same time.(Received July 3, 2019; Accepted February 26, 2020)