| Title |
Sintering Behavior and Thermal Properties of Cu-Graphite Materials by a Spark Plasma Sintering Method |
| Authors |
양민혁(Min-hyeok Yang); 박범순(Bum-soon Park); 문형석(Hyoung-seok Moon); 박재철(Jae-cheol Park); 박현국(Hyun-kuk Park) |
| DOI |
https://doi.org/10.3365/KJMM.2024.62.6.411 |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Keywords |
Cu-Gr; composite; spark plasma sintering method; sintering behavior; thermal properties |
| Abstract |
The use of heat dissipation materials in various field such as power semiconductor device, LED and microelectronic system. Therefore, there is a need for heat dissipation materials using copper (Cu) and graphite (Gr). These materials have high thermal conductivity. In particular, graphite has high thermal stability with a low coefficient of thermal expansion. This study was conducted to enhance the thermal properties of Cu for use in heat dissipation materials, using a spark plasma sintering method. Cu-Gr powders were mixed by a shaking mixer and fabricated with volume fractions of 7:3, 6:4, 5:5, 4:6 and 3:7. The spark plasma sintering method is a uniaxial pressurization process, which can control the direction of Gr. The Cu- Gr powders were sintered at a temperature of 850℃ at a heating rate of 30℃/min and a sintering pressure of 40MPa. Consequently, as the Gr contents were increased, the relative densities of the Cu-Gr composites decreased from 99.25 to 94.85%. Gr has high resistance to high-temperature deformation, which contributed to a decrease in shrinkage and relative density. The highest thermal conductivity was measured at 539.7 W/ m·K for a Cu-Gr volume ratio of 5:5. The thermal conductivity of the directionally controlled Gr was measured to be about 20-30 W/m·K higher than the uncontrolled sample. Furthermore, the TDP (Thermal distortion parameter), for which a lower value indicates better thermal stability, was systematically investigated.(Received 10 January, 2024; Accepted 18 March, 2024) |