| Title |
Effect of MPSA and PEG Addition on the Characteristics of Electrolytic Copper Foil |
| Authors |
박종재(Jong-jae Park); 윤준서(Jun-seo Yoon); 우태규(Tae-gyu Woo); 박일송(Il-song Park) |
| DOI |
https://doi.org/10.3365/KJMM.2025.63.3.210 |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Keywords |
Copper foil; Electroplating; Organic additive; MPSA; PEG; PVP |
| Abstract |
This study evaluated the effects of various amounts of MPSA and PEG on the surface properties, crystal structure, and mechanical properties of electrolytic copper foil, and PVP was used as an eco-friendly leveler. As the amount of MPSA increased, protrusions and dents were observed on the surface, which did not appear at 10 ppm MPSA. When the amount of PEG was increased, protrusions and dents were not observed. However, the surface roughness (Rz) increased with the addition of both MPSA and PEG. Regardless of the changes in the amount of MPSA and PEG, the priority direction of crystal growth was the (200) plane. When MPSA was added, the orientation index M values of (200), (220), and (311), which have high surface energy, increased. As the amount of PEG increased, the orientation of the (200) plane became unstable, and the orientation of the (111) plane was stabilized, increasing the M value of the (111) plane. The grain size decreased due to the increase in the amount of MPSA and PEG. Tensile strength and elongation were not significantly changed by the amount of MPSA, but did slightly increase with the amount of PEG. Consequently, adding 10 ppm MPSA resulted in excellent surface characteristics and mechanical characteristics, and PEG additives, the addition of 20-30 ppm was appropriate with respect to mechanical characteristics. |