KJMM

The Journal of
the Korean Journal of Metals and Materials

Monthly

pISSN : 1738-8228
eISSN : 2288-8241

Editorial Office

Tel. +82-2-557-1071
Fax. +82-2-557-1080
E-mail. metal@kim.or.kr

REFERENCES

Elshabini A.A., Barlow F., Wang P.J., Electronic packaging: semiconductor packages, Reference Module in Materials Science and Materials Engineering,Elsevier (2017)

Fattahi M., Vaferi K., Vajdi M., Moghanlou F. S., Namini A. S., Asl M. S., Ceram. Int,46, 11647 (2020)

Belyanin A.F., Bouilov L.L., Zhirnov V.V., Kamenev A.I., Kovalskij K.A., Spitsyn B.V., Diam. Relat. Mater,8, 369 (1999)

Bian Y., Liu M., Ke G., Chen Y., DiBattista J., Chan E., Yang Y., Surf. Coat. Tech,267, 65 (2015)

Heo Y.-J., Kim H.-T., Kim K.-J., Nahm S., Yoon Y.-J., Kim J., Appl. Therm. Eng,50, 799 (2013)

Xu R. L., Rojo M. M., Islam S. M., Sood A., Vareskic B., Katre A., Mingo N., Goodson K. E., Xing H. G., Jena D., Pop E., J. Appl. Phys,126, 185105 (2019)

Zhou Z., Xu Y., Chen X., Han C., Jiang W., Yang B., Xua B., Liu D., Ceram. Int,46, 4095 (2020)

Besleaga C., Dumitru V., Trinca L. M., Popa A.-C., Negrila C.-C., Kołodziejczyk Ł., Luculescu C.-R., Ionescu G.-C., Ripean R.-G., Vladescu A., Stan G. E., Nanomaterials,7, 394 (2017)

Zhang J., Huang J., Liu R., Luo G., Shen Q., Corros. Sci,190, 109672 (2021)

Zhang Y., Dai J., Bai G., Zhang H., Mater. Chem. Phys,241, 122374 (2020)

Legallais M., Mehdi H., David S., Bassani F., Labau S., Pelissier B., Baron T., Martinez E., Ghibaudo G., Salem B., ACS Appl. Mater. Interfaces,12, 39870 (2020)

Shahien M., Yamada M., Fukumoto M., Adv. Eng. Mater,20, 1700917 (2018)

Sakkaki M., Moghanlou F. S., Vajdi M., Asl M. S., Mohammadi M., Shokouhimehr M., Ceram. Int,46, 4998 (2020)

Zhang Z.-H., Liu Z.-F., Lu J.-F., Shen X.-B., Wang F.-C., Wang Y.-D., Scripta Mater,81, 56 (2014)

Du X., Qin M., Rauf A., Yuan Z., Yang B., Qu X., Mat. Sci. Eng. A,496, 269 (2008)

Qiao L., Zhou H., Li C., Mat. Sci. Eng. B,99, 102 (2003)

Wang J., Jia X., Jia C., Dong G., Zhang Y., Jia L., Rare Metals,30, 633 (2011)

Gao P., Jia C.-C., Cao W.-B., Wang C.-C., Xu G.-L., Liang D., Cui Z.-W., Rare Metals,41, 1369 (2022)

Gao P., Jia C.-C., Cao W.-B., Wang C.-C., Liang D., Xu G.-L., Int. J. Min Met. Mater,21, 589 (2014)

Radajewski M., Henschel S., Grützner S., Krüger L., Schimpf C., Chmelik D., Rafaja D., Ceram. Int,42, 10220 (2016)

He X., Gong Q., Guo Y., Liu J., J. Alloys Compd,675, 168 (2016)

Júnior L. A. F., Tomaz Í. V., Oliveira M. P., Simão L., Monteiro S. N., Ceram. Int,42, 18718 (2016)

Granon A., Goeuriot P., Thevenot F., J. Eur. Ceram. Soc,15, 249 (1995)

Chen W., Wang B., Liu L., Wang H., Wang X., Ceram. Int,46, 26035 (2020)

Sokol M., Kalabukhov S., Shneck R., Zaretsky E., Frage N., J. Eur. Ceram. Soc,37, 3417 (2017)

Zhang Z., Zhang M., Wang X., Li W., High Temp. Mater. Process,27, 102 (2008)

Reddy N., Bera P., Reddy V. R., Sridhara N., Dey A., Anandan C., Sharma A. K., Ceram. Int,40, 11099 (2014)

Fuggle J. C., Surf. Sci,69, 581 (1977)

Strohmeier B. R., Surf. Sci. Spectra,3, 121 (1994)

Taborda J. A. P., Riascos H., Vera L. P., IEEE Sens. J,16, 359 (2016)

von Richthofen A., Domnick R., Thin Solid Films,283, 37 (1996)

Wei Y., Gu S., Fang H., Luo W., Wang L., Jiang W., J Am Ceram Soc,103, 5382 (2020)

Zhang Y., Song A., Ma D., Zhang X., Ma M., Liu R., J. Alloys Compd,608, 304 (2014)

Ganesh I., Int. Mater. Rev,58, 63 (2013)

Cheng X., Liu L., Qiu G., Bai Z., Guo M., Cheng F., Zhang M., Int. J. Mater. Res,111, 537 (2020)

Dai W., Yamaguchi A., Lin W., Ommyoji J., Yu J., Zou Z, J. Ceram. Soc. Jpn,115, 525 (2007)

Smith D. S., Puech F., Nait-Ali B., Alzina A., Honda S., Int. J. Heat Mass Tran,121, 1273 (2018)

Kobayashi R., Moriya Y., Imamura M., Oosawa K., Oh-Ishi K., J. Ceram. Soc. Jpn,119, 291 (2011)

Lee H.-K., Kim D.-K., J. Am. Ceram. Soc,93, 2167 (2010)

Liao K., Shibata K., Mizoguchi T., Nano Lett,21, 10416 (2021)

Liu L., Morita K., Suzuki T. S., Kim B.-N., J. Eur. Ceram. Soc,41, 2096 (2021)

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KJMM Korean Journal of Metals and Materials

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REFERENCES