KJMM
toggle navigation
KJMM
Latest articles
About KJMM
Aims and Scope
About the Journal
Editorial Board
Open Access
All issues
For Authors & Reviewers
Instruction for Authors
Ethics
Contact us
KIM
Contact
KJMM
Korean Journal of Metals and Materials
About KJMM
Aims and Scope
About the Journal
Editorial Board
Open Access
Latest articles
All issues
For Authors &
Reviewers
Instruction for Authors
Ethics
Contact us
The Journal of
the Korean Journal of Metals and Materials
The Journal of
the Korean Journal of Metals and Materials
Open Access Journal
Monthly
pISSN : 1738-8228
eISSN : 2288-8241
All issues
Submit Your Article
KJMM 2024, 2025
Field-Specific Paper List
Editorial Office
Tel.
+82-2-557-1071
Fax.
+82-2-557-1080
E-mail.
metal@kim.or.kr
Home
All Issues
2025-07
(Vol.63, No.7)
10.3365/KJMM.2025.63.7.475
Journal XML
XML
PDF
INFO
REF
REFERENCES
1
Qing L., Wang Y., Zhang H., Mater,16, 2841 (2023)
2
Schmidt F.F., Ogden H.R., The Engineering Properties of Molybdenum and Molybdenum Alloys, Vol. 190,1-95, Defense Metals Information Center, Battelle Memorial Institute (1963)
3
Saji V.S., Lee C.-W., ChemSusChem,5, 1146 (2012)
4
Oker E., Merte H., J. Heat Transfer,103, 65 (1981)
5
Reid F.H., Goldie W., Brooman E.W., Gold Plating Technology,12-18, Electrochemical Society, Inc. (1975)
6
Blair A., Plating Surf. Finish,86, 52 (1999)
7
Green T.A., Gold Bull,40, 105 (2007)
8
Im E., Cho K., Park J., Proc. AIAA SPACE 2007 Conf. & Exposition,1-10, AIAA (2007)
9
Gao W., Huang J., He J., InfoMat,5, (2023)
10
Onuki J., Ueno H., Tamura H., IEEE Trans. Electron Devices,44, 2154 (1997)
11
Kohl P.A., Electrodeposition of Gold, in Modern Electroplating,115-130, Wiley (2011)
12
Baudrand D., Bengston J., Met. Finish,93, 55 (1995)
13
Griffiths M.B.E., Pallister P.J., Mandia D.J., Barry S.T., Chem. Mater,28, 44 (2016)
14
Wiesner H., Plating on Difficult-to-Plate Metals: What's New?,Proc. Plating on Difficult-to-Plate Metals Symp., 1-18, Lawrence Livermore Natl. Lab. (1980)
15
Gomez E., Pellicer E., Valles E., J. Appl. Electrochem,33, 245 (2003)
16
Jarboe D., Automatic Lead Frame Plating, Final Report,1-50, Bendix Corp. (1975)
17
Nguyen T., Park J.H., Lee C.Y., Surf. Coat. Technol,141, 108 (2001)
18
Finne R., Bracht W., J. Electrochem. Soc,113, 551 (1966)
19
Samwel S.W., Space Res. J,7, 1 (2014)
20
Cheh H.Y., J. Electrochem. Soc,118, 551 (1971)
21
Pourbaix M., Atlas of Electrochemical Equilibria in Aqueous Solutions,1-644, NACE (1974)
22
Deng K., Erofeev I., Chowdhuri A.R., Philipsen H., Small,20, (2024)
23
Wilkinson P., Gold Bull,19, 75 (1986)
24
Dimitrijević S., Rajčić-Vujasinović M., Trujić V., Int. J. Electrochem. Sci,8, 6620 (2013)
25
Vander Voort G.F., Metallography and Microstructures,1-500, ASM International (2004)
26
Petzow G., Metallographic Etching: Techniques for Metallography, Ceramography and Plastography,1-300, ASM International (1999)
27
Zhang L., Chen Y., Pan C., J. Mol. Liq,426, 127375 (2025)
뒤로가기