KJMM

The Journal of
the Korean Journal of Metals and Materials

Monthly

pISSN : 1738-8228
eISSN : 2288-8241

Editorial Office

Tel. +82-2-557-1071
Fax. +82-2-557-1080
E-mail. metal@kim.or.kr

REFERENCES

Lau J. H., IEEE Trans. Compon. Packag. Manuf. Technol,12, 228 (2022)

Choi K.-S., Eom Y.-S., Jang K.-S., Bae H.-C., Proc. 72nd Electron. Compon. Technol. Conf. (ECTC),198IEEE (2022)

Nonaka T., Kobayashi Y., Asahi N., Niizeki S., Fujimaru K., Proc. Electron. Compon. Technol. Conf. (ECTC),913IEEE (2014)

Seyama K., Wada S., Eguchi Y., Nakamura T., Day D., Sugawa S., Proc. Electron. Compon. Technol. Conf. (ECTC),392IEEE (2018)

Jung Y., Ryu D., Gim M., Kim C., Song Y., Kim J., Yoon J., Lee C., Proc. Electron. Compon. Technol. Conf. (ECTC),392IEEE (2016)

Choi K.-S., Junior W. A. Braganca, Jang K.-S., Bae H.-C., Eom Y.-S., Proc. Int. Symp. Microelectron. (IMAPS),67IMAPS (2017)

Wentlent L. A., Genanu M., Alghoul T., Proc. Electron. Compon. Technol. Conf. (ECTC),425IEEE (2018)

Braganca W. A., Eom Y.-S., Jang K.-S., Moon S. H., Bae H.-C., Choi K.-S., ETRI J,41, 396 (2019)

Choi K.-S., Eom Y.-S., Jang K.-S., Bae H.-C., Proc. 69th Electron. Compon. Technol. Conf. (ECTC),197IEEE (2019)

Joo J., Choi G., Lee C., Kye I., Eom Y., Jang K., Hwang S., Kim J. D., Choi K., SID Symp. Dig. Tech. Pap,53, 1005 (2022)

Moon Y. H., Choi G.-M., Joo J., Choi K.-S., Jang K.-S., Proc. 73rd Electron. Compon. Technol. Conf. (ECTC),1IEEE (2023)

Jun Z., Fei Y. X., Hailin S., Proc. 19th Int. Conf. Electron. Packag. Technol. (ICEPT),834IEEE (2018)

Shen L., Proc. Int. Conf. Mech. Autom. Control Eng,3634IEEE (2010)

Han B. J., Kim Y., Lee J.-H., Korean J. Met. Mater,61, 679 (2023)

Choi G.-M., Jang K.-S., Choi K.-S., Joo J., Yun H.-G., Lee C., Eom Y.-S., Polymers,13, 957 (2021)

Jang K.-S., Eom Y.-S., Choi K.-S., Bae H.-C., Polym. Int,67, 1241 (2018)

Eom Y.-S., Choi G.-M., Jang K.-S., Joo J., Lee C., Oh J.-H., Moon S.-H., Choi K.-S., ETRI J,46, 347 (2024)

Tang C., Chen Z., Fang M., Xiao X., Chen G., Zhu W., J. Mater. Res. Technol,18, 1865 (2022)

Zhou X., Li Y., Yang X., Xie A., Wang H., Cao C., Proc. 23rd Int. Conf. Electron. Packag. Technol. (ICEPT),1IEEE (2022)

Jang D. I., Kim G., Kim D., Oh M., Kim G. H., Park Y. B., Korean J. Met. Mater,62, 312 (2024)

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KJMM Korean Journal of Metals and Materials

Editorial Office

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REFERENCES