The Journal of
the Korean Journal of Metals and Materials

The Journal of
the Korean Journal of Metals and Materials

Monthly
  • pISSN : 1738-8228
  • eISSN : 2288-8241

Editorial Office

REFERENCES

1 
Gan C. L., Classe F., Chan B. L., Hashim U., Microelectronics Int,31, 121 (2014)Google Search
2 
Yoo Y. R., Kim G. B., Jeon S. M., Park H. J., Seo W. W., Moon J. T., Kim Y. S., 7275, Mat,16, 1 (2023)Google Search
3 
Rosli M. S. A. M., Rusdi M. S., Hassan M. H., Seman S. A. H. A., Rohseli S., Jamaludin N., Rahman O. A., Int. J. Nanoelectronics and Mat,16, 405 (2023)Google Search
4 
Kim S. Y., Jeon S. M., Park H. J., Kim S. H., Shin J. J., Song O. S., Korean J. Met. Mater,62, 9 (2024)Google Search
5 
Breach C. D., Shen N. H., Mun T. W., Lee T. K., Holyday R., 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2010), https://www.proceedings.com/09423.html, (2010)Google Search
6 
Kim H. J., Kim G. H., Ko Y. H., Baek C. M., Park J. H., Park Y. B., Korean J. Met. Mater,62, 9 (2024)Google Search
7 
Automotive Electronics Council, AEC Q100, http://www.aecouncil.com/AECDocuments.html (2023),
8 
Zhou H. L., Zhang Y. C., Cao J., Su C. H., Li C., Chang A., An B., Micromachines 14,432, 1 (2023)Google Search
9 
Choi Y. C., Teck S. C., Poh L. T., Hoon H. P., Diong S., Int. Electronic Manufacturing Technol,Putrajaya (2006)Google Search
10 
Xu H., Liu C., Silberschmidt V. V., Pramana S. S., White T. J., Chen Z., Acoff V. L., Scripta Materialia,65, 642 (2011)Google Search
11 
Karpel A., Gur G., Atzmon Z., Kaplan W. D., J. Mater. Sci,42, 2347 (2007)Google Search
12 
Noolu N. J., Murdeshwar N. M., Ely K. J., Lippold J. C., Baeslack W. A., J. Mater. Res,19, 1374 (2004)Google Search
13 
Lall P., Deshpande S., Comparison of Reliability of Copper, Gold, Silver, and PCC Wirebonds Under Sustained Operation at 200 °C, https://www.circuitinsight.com/pdf/comparison_reliability_copper_gold_siler_pcc_wirebonds_smta.pdf, (2018)
14 
Bahi M. A., Lecuyer P., Gentil A., Fremont H., Landesman J. P., Christien F., Electronics Packaging, Technol. Conf., 800IEEE (2008)Google Search
15 
Hwang J. S., Kumar B. S., Moon J. T., Uhm C., Kim Y. N., Sivakumar M., Yew S. K., Electronics Packaging, Technol. Conf., 795IEEE (2008)Google Search
16 
Chang H. S., Hsieh K. C., Martens T., Yang A., J. Electronics Mater,32, 1182 (2003)Google Search