The Journal of the Korean Journal of Metals and Materials
Surface Treatment : Effects of Plating Parameters on the Microstructure of Sn - Bi Electrodeposits and the Growth Kinetics of Intermetallic Compounds in Sn - Bi / Cu Interface
Surface Treatment : Microstructure of Surface Defects Observed on Continuous Hot - dip Galvanized and Galvannealed Coating Steels
Mathematical Modeling : Kinetic Study on Precipitation of Ti2O3 Inclusion During Solidification of Ti - killed Low Carbon Steel
Welding & Joining : The Effects of Thermal Aging on Fracture Characteristics of Sn - Ag Solder Joint
Welding & Joining : Study on the Fabrication of Flip Chip Lead - free Solder Bump by Electroplating
Pyrometallurgy : Thermodynamics of Zinc in Fe - C Melt at High Temperatures
Hydrometallurgy : Recovery of Nitric acid and Valuable Metals from Spent Nitric Etching Solutions of Printed Circuit Board
Materials Processing : Studies on Characteristics of Mold Level Fluctuation in Thin Slab Casting