The Journal of
the Korean Journal of Metals and Materials

The Journal of
the Korean Journal of Metals and Materials

Monthly
  • pISSN : 1738-8228
  • eISSN : 2288-8241

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All issues http://journal.cricit.kr/kjmm

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2024-04

202404 (Vol.62, No.4)

P.251

Effect of Fe Composition and Heat Treatment Temperature on the Transformation Temperature of R-Phase of Ti-Ni-Fe Alloy

김원석(Wonseok Kim); 금나영(Nayoung Keum); 김진용(Jinyoung Kim); 김재일(Jaeil Kim)
https://doi.org/10.3365/KJMM.2024.62.4.251
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P.257

A Novel Al-Al2O3 Non-Skid Composite Coating with Improved Wear Resistance Fabricated by Twin Wire Arc Spraying

권한솔(Hansol Kwon); 박영진(Youngjin Park); 강용진(Yongjin Kang); 김도현(Dohyun Kim); 남욱희(Uk Hee Nam); 변응선(Eungsun Byon)
https://doi.org/10.3365/KJMM.2024.62.4.257
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P.267

Effect of Grain Size on High Temperature Oxidation Behavior of IN792 Superalloy

방지예(Ji-ye Bang); 이동현(Dong-hyun Lee); 이수열(Soo Yeol Lee)
https://doi.org/10.3365/KJMM.2024.62.4.267
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P.275

A Study on the Treatment and Recovery of Sodium Sulfate (Na2SO4) Generated When Recovering Valuable Metals (Ni, Co, Mn, Li) from Waste Lithium Ion Batteries(LIBs)

조연철(Yeonchul Cho); 서민혁(Minhyuk Seo); 이영재(Youngjae Lee); 안재우(Jaewoo Ahn)
https://doi.org/10.3365/KJMM.2024.62.4.275
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P.284

Surfactant Composition Dependent Evolution of Electronic/Structural Properties of P3HT Nanoparticle Colloids Synthesized via Mini-Emulsion Technique

박병남(Byoung-nam Park)
https://doi.org/10.3365/KJMM.2024.62.4.284
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P.292

Tuning Dielectric Constant of P3HT by Ultrasound-Induced Aggregation

박병남(Byoung-nam Park)
https://doi.org/10.3365/KJMM.2024.62.4.292
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P.299

Improvement in the Hydrogen-Storage Properties of Mg2Ni by Adding LiBH4

(Young Jun Kwak); (Myoung Youp Song); (Ki-tae Lee)
https://doi.org/10.3365/KJMM.2024.62.4.299
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P.306

Enhancement of Flexural Strength by Slip Casting Cordierite Ceramics with h-BN Nanoparticles

박철오(Chul Oh Park); 이종현(Jong Hyun Lee); 이동균(Dong Kyun Lee); 조현준(Hyun Jun Cho); 임성환(Sung Hwan Yim); 이규형(Kyu Hyoung Lee)
https://doi.org/10.3365/KJMM.2024.62.4.306
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P.312

Effects of Post-annealing Condition on Interfacial Reaction and Bonding Strength of Cu/Sn-3.0Ag-0.5Cu/Al Joint for Heat Dissipation Module Application

정동익(Dong Ik Jeong); 김가희(Gahui Kim); 김도헌(Doheon Kim); 오민철(Minchul Oh); 김건홍(Geon-hong Kim); 박영배(Young-bae Park)
https://doi.org/10.3365/KJMM.2024.62.4.312
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