The Journal of
the Korean Journal of Metals and Materials

The Journal of
the Korean Journal of Metals and Materials

Monthly
  • pISSN : 1738-8228
  • eISSN : 2288-8241

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2024-09

202409 (Vol.62, No.9)

P.673

Fabrication of 3D Interconnected Fe80Cr20-Mg Ultrafine-grained Heterostructure Composite Materials Using High-pressure Torsion: Effects of Sample Thickness

하수빈(Soo Vin Ha); 구강희(Gang Hee Gu); 김형섭(Hyoung Seop Kim); 주수현(Soo-hyun Joo)
https://doi.org/10.3365/KJMM.2024.62.9.673
P.685

Quantitative Characterization of the Microstructure of an Induction Heat-treated Low Alloy Steel using EBSD

김은아(Eunah Kim); 정수진(Sujin Jeong); 강신곤(Singon Kang)
https://doi.org/10.3365/KJMM.2024.62.9.685
P.696

Effect of Al2O3 Content and Particle Size of Iron Ore on the Assimilation Characteristics of Sintered Ore

서준기(Jun Gi Seo); 송재민(Jae Min Song); 이도연(Do Yeon Lee); 박태준(Tae Jun Park); 권한중(Han Jung Kwon)
https://doi.org/10.3365/KJMM.2024.62.9.696
P.705

Effects of Palladium Content on the Properties and High-Humidity Reliability of Silver Alloy Wires

김상엽(Sang-yeob Kim); 전성민(Sung-min Jeon); 박현준(Hyun-jun Park); 김승현(Seong-hyun Kim); 신종진(Jong-jin Shin); 송오성(Oh-sung Song)
https://doi.org/10.3365/KJMM.2024.62.9.705
P.713

Bimetallic CoM-ZIF/CdS Photocatalyst Including Transition Metals(M) for Solar Water Splitting

김주현(Joo Hyun Kim); 이유림(Yurim Lee); 안채현(Chaehyun An); 이수민(Sumin Yi); 김정현(Jung Hyeun Kim)
https://doi.org/10.3365/KJMM.2024.62.9.713
P.726

Effects of Au Bump Process Condition on the Interfacial Reaction and Mechanical Reliability of Non-cyanide Au Bump for Display Driver IC Bonding

김혜진(Hyejin Kim); 김가희(Gahui Kim); 고용호(Yong-ho Ko); 백철민(Chul-min Baek); 박주현(Joo-hyeon Park); 박영배(Young-bae Park)
https://doi.org/10.3365/KJMM.2024.62.9.726
P.735

The Electrical, Optical, Heating Property and Electromagnetic Wave Shield Effect of TiO2/Ag/TiO2 Thin Films

김지호(Jiho Kim); 김유성(Yu-sung Kim); 최진영(Jin-young Choi); 이연학(Yeon-hak Lee); 공영민(Young-min Kong); 김대일(Daeil Kim)
https://doi.org/10.3365/KJMM.2024.62.9.735
P.740

Influence of Rapid Thermal Processing on the Machining Properties of Copper Thin Films for Nano/Micro Pattern Fabrication

황해인(Hae-in Hwang); 김수연(Suyeon Kim); 조인호(In-ho Jo); 이승훈(Seung-hun Lee); 박아현(Ahyun Park); 김정환(Jeong Hwan Kim)
https://doi.org/10.3365/KJMM.2024.62.9.740