The Journal of
the Korean Journal of Metals and Materials

The Journal of
the Korean Journal of Metals and Materials

Monthly
  • pISSN : 1738-8228
  • eISSN : 2288-8241

Editorial Office

REFERENCES

1 
Tang H. Y., Li F., Xiao Y. C., Wu B. A., Guo W. M., Luo F. L., Luo W. F., Liu Q. B., Int. Microsyst. packag. Assembly and Circuits Technol. conf., 131 (2019)Google Search
2 
Zou Y. S., Gan C. L., Chung M. H., Takiar H., J. Mater. Sci: Mater Electron,32, 27133 (2021)Google Search
3 
Lu C., Int. Microsyst. Packag. Assembly and Circuits Technol. conf., 226-229, (2013)Google Search
4 
Gu L., Chen Q., Li J., Chen Z., Zhou J., Du M., Chung M. K., ECS Trans,52, 747 (2013)Google Search
5 
Zhou H., Zhang Y., Cao J., Su C., Li C., Chang A., An B., J. of Micromachines,14, 1 (2023)Google Search
6 
Lee H. -W., Kong B. -O., Kim S. E., Joo Y., Yoon S., Lee J. H., Korean J. Met. Mater,60, 282 (2022)Google Search
7 
Kang D.-S., Lee H., Yun D. W., Jeong H. W., Yoo Y.-S., Seo S.-M., Korean J. Met. Mater,60, 782 (2022)Google Search
8 
Jalar A., Rosle M. F., Hamid M. A. A., Solid State and Technol,16, 240 (2008)Google Search
9 
Lai Y. L., Chiang W. J., Mater. and Technol. in Precision Machinery,661, 121 (2015)Google Search
10 
Guang M. X., Jian C., Zheng C., Wen Y., Sci. China,58, 1146 (2015)Google Search
11 
Cheng C. H., Hsiao H. L., Chu S. I., Shieh Y. Y., Sun C. Y., Peng C., Electro. Components & Technol. Conf, 1569-1573, (2013)Google Search
12 
Wu J., Yang J. H., Yauw O., Qin I., Rockey T., Chylak B., Electro. Packag. Technol. Conf, 472-476, (2014)Google Search
13 
Cho J. H., Rollett A. D., Cho J. S., Park Y. J., Moon J. T., OH K. H., Metall. and Mater. Trans. A,37A, 3085 (2006)Google Search
14 
Hsueh H. W., Hung F. Y., Lui T. S., CChenen L. H., CChenen K. J., Adv. in Mater. Sci. and Eng,2014, 1 (2014)Google Search
15 
Fu S. W., Lee C. C., J. of Mater. Sci. : Mater. in Electro,29, 3985 (2018)Google Search
16 
Huang W. H., Lin K. L., Lin Y. W., Cheng Y. K., Met. & Mater. Soc,45, 6130 (2016)Google Search