KJMM

The Journal of
the Korean Journal of Metals and Materials

Monthly

pISSN : 1738-8228
eISSN : 2288-8241

Editorial Office

Tel. +82-2-557-1071
Fax. +82-2-557-1080
E-mail. metal@kim.or.kr

REFERENCES

Han B. D., Go J. U., Kim Y. G., journal of KIIEE,30, 39 (2016)

Tong X. C., Advanced Materials for Thermal Management of Electronic Packaging,616Springer Science & Business Media (2011)

Kim P.-J., Park D.-K., JKAIS,20, 310 (2019)

Lee J. H., Ryoo S. R., Chun J. H., Kim J. M., Kim H. J., Kim C. J., Suh M. W., Transactions of the KSME B,31, 367 (2007)

Kim J. D., J. of Power Syst. Eng,10, 31 (2006)

Kim D. H., Sa Y. C., Chung B. Y., Park B. D., KHNES,24, 444 (2013)

Yang S. H., Master’s Thesis,1-3, Pusan National University (2013)

Corrosion of aluminum and aluminum alloys,19-21, ASM International (1999)

Eom D. H., Master's Thesis,1-6, Pukyong National University (2013)

Shin D.-H., Kim S.-J., CORROSION SCIENCE AND TECHNOLOGY,19, 310 (2020)

Ji H., Jeong C., J. Surf. Sci. Eng,51, 372 (2018)

Vargel C., Corrosion of Aluminium,9-109, Elsevier (2004)

Chang Q., Xie J., Mao A., Wang W., Metals,8, 770 (2018)

Gao X., Bian L., Zhao J., Han J., Wang T., Huang Q., J. Mater. Res. Technol,13, 216 (2021)

Dubba S. K., Kumar R., Exp. Therm. Fluid Sci,81, 370 (2017)

Son K. D., Park S. G., Jeong J. H., Kim Y. S., Proceedings of the SAREK Conference,263 (2008)

Sayyadi R., Khodabakhshi F., S N., Khatibi G., J. Mater. Res. Technol,9, 8953 (2020)

Son K., Kim G., Ko Y. H., Park Y. B., J. Microelectron. Packag. Soc,26, 81 (2019)

Shin Y. E., Hwang S. J., J. Korean Inst. Electr. Electron. Mater. Eng,16, 549 (2003)

Suh D., Kim D. W., Liu P., Kim H., Weninger J. A., Kumar C. M., Prasad A., Grimsley B. W., Tejada H. B., Mater. Sci. Eng. A,460, 595 (2007)

Shin H. P., Ahn B. W., Ahn J. H., Lee J. G., Kim K. S., Kim D. H., Jung S. B., Journal of KWJS,30, 458 (2012)

Kwak B.-H., Jeong M.-H., Park Y. B., Korean J. Met. Mater,50, 775 (2012)

Kim S.-H., Kim J.-M., Yoo S. H., Park Y. B., J. Microelectron. Packag. Soc,19, 57 (2012)

Kwak B.-H., Jeong M.-H., Kim J.-W., Lee B. H., Lee H. J., Park Y. B., Microelectron Eng,89, 65 (2012)

Kim B.-J., Lim G. T., Kim J. D., Lee K. W., Park Y. B., Lee H. Y., Joo Y.-C., Met. Mater. Int,15, 815 (2009)

Peng W., Monlevade E., Marques M. E., Microelectron. Reliab,47, 2161 (2007)

Tu K. N., Thompson R. D., Acta metal,30, 947 (1982)

Hu X., Xu T., Keer L. M., Li Y., Jiang X., Mater. Sci. Eng. A,673, 167 (2016)

Kim K. Y., Choi I. C., Ito K., Oh M. H., J. of the Korean Society for Heat Treatment,32, 79 (2019)

Kim M. J., Lee K. S., Han S. H., Hong S.I., Mater. Charact,174, 111021 (2021)

Kim S.-H., Lee B. R., Kim J.-M., Yoon S. H., Park Y. B., Kor. J. Mater. Res,24, 166 (2014)

Kim S.-H., Park G. T., Lee B. R., Kim J.-M., Yoon S. H., Park Y. B., J. Microelectron. Packag. Soc,22, 47 (2015)

Kim S.-H., Lee B. R., Park G. T., Kim J.-M., Yoon S. H., Park Y. B., Korean J. Met. Mater,53, 735 (2015)

ASTM International, ASTM D1002–10, standard test method for apparent shear strength of single-lap-joint adhesively bonded metal specimens by tension loading (metal-to-metal),1-6, ASTM Book of Standards (2019)

Kim G., Son K., Park G. T., Park Y. B., Korean J. Met. Mater,55, 798 (2017)

Tu K. N., Solder Joint Technology, Materials, Properties, and Reliability,59-71, Springer (2007)

Jeong S. W., Kim J. H., Kim H. D., Lee H. M., J. Microelectron. Packag. Soc,10, 37 (2003)

Kim Y., Kwon J., Yoo D., Park S., Lee D., Lee D., Korean J. Met. Mater,55, 165 (2017)

Chang E. -G., Kim N. -H., Kim N. -K., Eom J. -C., J. Korean Inst. Electr. Electron. Mater. Eng,17, 267 (2004)

Jeong M.-H., Kim J. M., Yoo S. H., Lee C. W., Park Y. B., J. Microelectron. Packag. Soc,17, 81 (2010)

Kang S. K., Choi W. K., Shih D. Y., Henderson D. W., Gosselin T., Sarkhel A., Goldsmith C., Puttlitz K.J., JOM,55, 61 (2003)

Sabri M. F. M., Shnawah D. A., Badruddin I. A., Said S. B. M., Che F. X., Ariga T., Mater. Charact,78, 129 (2013)

Jee Y. K., Xia Y., Yu J., Kang H. W., Lee T. Y., 2008 Proceedings 58th Electronic Components and Technology Conference, 491IEEE, Lake Buena Vista (2008)

Xia Y. H., Jee Y. K., Yu J., Lee T. Y., J. Electron. Mater,37, 1858 (2008)

Huang M. L., Hou X. L., Kang N., Yang Y. C., J. Microelectron. Packag. Soc,25, 2311 (2014)

Maslinda K., Anasyida A. S., Nurulakmal M. S., J. Microelectron. Packag. Soc,27, 489 (2016)

Walleser J. K., Master’s Thesis,16-18, Iowa State University (2008)

Oliveira R., Cruz C., Barros A., Bertelli F., Spinelli J. E., Garcia A., Cheung N., J. Therm. Anal. Calorim,147, 4945 (2022)

Li Y., Leng X., Cheng S., Yan J., Mater Design,40, 427 (2012)

Choi S., Bieler T. R., Lucas J. P., Subramanian K. N., J. Electron. Mater,28, 1209 (1999)

Liu J., Huang M. L., Zhao N., Zhang L., 16th ICEPT(IEEE), Changsha (2015)

Kah P., Vimalraj C., Martikainen J., Suoranta R., Int. J. Mech. Mater. Eng,10, 10 (2015)

Tanga F., Meeks H., Spowart J.E., Gnaeupel-Herold T., Prask H., Anderson I.E., Mater. Sci. Eng. A,386, 194 (2004)

Kim J. H., Hyun C. Y., J. Microelectron. Packag. Soc,21, 91 (2014)

뒤로가기

No part of this publication may be reproduced or distributed in any form or any means, or stored in a data base or retrieval system, without the prior permission of the publisher ( https://kim.or.kr ).

KJMM Korean Journal of Metals and Materials

Editorial Office

Journal XML

REFERENCES