The Journal of
the Korean Journal of Metals and Materials

The Journal of
the Korean Journal of Metals and Materials

Monthly
  • pISSN : 1738-8228
  • eISSN : 2288-8241

Editorial Office

REFERENCES

1 
Richards B., Nimmo K., http://eprintspublications.npl.co.uk/id/eprint/1080, An Analysis of the Current Status of Lead-Free Soldering Update 2000, (2000)Google Search
2 
Suganuma K., Curr. Opin. Solid State Mater. Sci,5, 55 (2001)Google Search
3 
Terachima S., Kariya Y., Hosoi T., Tanaka M., J. Electron. Mater,32, 1527 (2003)Google Search
4 
Syed A., Scanlan J., Cha S.W., Kang W. J., Sohn E. S., Kim T. S., Ryu C. G., Impact of package design and materials on reliability for temperature cycling, bend, and drop loading conditions,2008 58th Electronic Components and Technology Conference, USA, 1453-1461, (2008)Google Search
5 
Zhao X. J., Caers J. F. J. M., de Vries J. W. C., Kloosterman J., Wong E. H., Rajoo R., Improvement of mechanical impact resistance of BGA packages with Pbfree solder bumps,2006 8th Electronics Packaging Technology Conference, Singapore, 174-178, (2006)Google Search
6 
Bizer C., Raow B., Steiner R., Walter J., Drop test reliability improvement of lead-free fine pitch BGA using different solder ball composition,2005 7th Electronic Packaging Technology Conference, Singapore, (2005)Google Search
7 
Terashima S., Kohno T., Mizusawa A., Arai K., Okaga O., Wakabayashi T., Tanaka M., Tatsumi K., J. Electron. Mater,38, 33 (2009)Google Search
8 
Chen Z., Shi Y., Xia Z., Yan Y., J. Electron. Mater,32, 235 (2003)Google Search
9 
Xiao W., Shi Y., Lei Y., Xia Z., Guo F., J. Electron. Mater,35, 1095 (2006)Google Search
10 
Tsao L. C., Mater. Sci. Eng. A,529, 41 (2011)Google Search
11 
Gain A. K., Fouzder T., Chan Y. C., Sharif A., Wong N. B., Yung Winco K.C., J Alloys Compd,506, 216 (2010)Google Search
12 
Shen J., Chan Y. C., J Alloys Compd,477, 552 (2009)Google Search
13 
Lee I. B., Lee Y. W., Lee T. K., Crack Propagation Mechanism Study on Bismuth Contained Base Lead Free Solder,2018 SMTA International Conference, USA, (2018)Google Search
14 
Son J. Y., Lee S. G., Park J. W., Lee Y. W., Jung S. B., Modifying of Tin based solder composition with optimized Bi, Ni and Cu contents for high TC and drop shock reliability,2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), Singapore, 1-5, (2022)Google Search
15 
Wang B., Hu X. J., Sun W., Liao J. L., Peng H. L., Hou N., Chen B., Zeng G., Mater. Charact,198, 112707 (2023)Google Search
16 
Schindler S., Mueller M., Wiese S., Investigation of the undercooling of SnCu solder spheres,2014 5th Electronics System-integration Technology Conference (ESTC), Finland, 1-7, (2014)Google Search
17 
Min-Bo Z., Xiao M., Xin-Ping Z., Size effect on the intermetallic compound coalescence in Sn-Ag-Cu solder and Sn-Ag-Cu/Cu solder joints,2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, China, 1-6, (2011)Google Search
18 
Cui Y., Xian J. W., Zois A., Marquardt K., Yasuda H., Gourlay C. M., Acta Materialia,249, 118831 (2023)Google Search
19 
Reid M., Punch J., Collins M., Ryan C., Solder. Surf. Mt. Technol,20, 3 (2008)Google Search
20 
Kariya Y., Hosoi T., Terachima S., Tanaka M., Otsuka M., J. Electron. Mater,33, 321 (2004)Google Search
21 
Kinyanjui R., Lehman L. P., Zavalij L., Cottsa E., J. Mater. Res,20, 2914 (2005)Google Search
22 
Li X. P., Xia J. M., Qin H. B., He X. Q., Zhang X. P., Study of critical factors influencing the solidification undercooling behavior of Sn-3.0Ag-0.5Cu (SAC) lead-free solder and SAC/Cu joints,2012 13th International Conference on Electronic Packaging Technology & High Density Packaging, China, 356-360, (2012)Google Search
23 
Liu Y., Sun F., Li X., J Mater Sci: Mater Electron,25, 2627 (2014)Google Search
24 
Zhao J., Qi L., Wang X. M., Wang L., J Alloys Compd,375, 196 (2004)Google Search
25 
Hodúlová E., Li H., Šimeková B., Kovaříková I., Weld World,62, 1311 (2018)Google Search
26 
Chen Y., Meng Z. C., Gao L. Y., Liu Z. Q., J Mater Sci: Mater Electron,32, 2172 (2021)Google Search
27 
Scherrer P, Nachr. Ges. Wiss. Gottingen,2, 96 (1918)Google Search
28 
Wang F., Chen H., Huang Y., Yan C., J Mater Sci: Mater Electron,29, 11409 (2018)Google Search
29 
Nogita K., Mohd Salleh M. A. A., Smith S., Wu Y. Q., Mcdonald S. D., ab Razak A. G., Akaiwa T., Nishimura T., Effects of Bi in Sn-Cu based lead-free solder alloys and interconnects,2017 International Conference on Electronics Packaging (ICEP), Japan, 377-380, (2017)Google Search
30 
Shen Y. A., JOM,75, 4922 (2023)Google Search
31 
Raza M., Shewchenko L., Qlofinjana A., Kent D., Mata J., Haque R., J Mater Sci: Mater Electron,32, 22155 (2021)Google Search
32 
Jo M. G., Ryu S. H., Kim K. I., Kim D. E., Kim J. I., Kim K. T., Kim S. S., Cho G. S., Korean J. Met. Mater,60, 251 (2022)Google Search
33 
Son H. W., Koo T. M., Cho Y. H., Lee J. M., Korean J. Met. Mater,61, 472 (2023)Google Search
34 
Chen Z., Wang X., Bhakhri V., Giuliani F., Atkinson A., Acta Mater,61, 5720 (2013)Google Search
35 
Hu C., Li Z., Constr. Build. Mater,90, 80 (2015)Google Search
36 
Bae J. Y., Kim M. S., Lee H. M., Lee S. G., Lee Y. W., Moon J. T., Hong W. S., J Weld Join,41, 379 (2023)Google Search
37 
Laurila T., Vuorinen V., Kivilahti J.K., Mater. Sci. Eng. R Rep,49, 1 (2005)Google Search
38 
Yoon J. W., Kim S. W., Jung S. B., J Alloys Compd,392, 247 (2005)Google Search
39 
Lee T. K., Zhou B., Bieler T., Liu K. C., Electron. Mater,41, 273 (2012)Google Search
40 
Fu S. W., Yu C. Y., Lee T. K., Liu K. C., Duh J. G., Mater,80, 103 (2012)Google Search
41 
Kim Y. M., Roh H. E., Kim S. T., Kim Y. H., J. Electron. Mater,39, 2504 (2010)Google Search
42 
Wu Y., Sees J. A., Pouraghabagher C., Foster L. A., Marshall J. L., Jacobs E. G., Pinizzotto R. F., J. Electron. Mater,22, 769 (1993)Google Search
43 
Vianco P. T., Rejent J. A., Hlava P. F., J. Electron. Mater,33, 991 (2004)Google Search
44 
Tegehall P. E., Review of the impact of intermetallic layers on the brittleness of tin.lead and lead-free solder joints, IVF project report 06/07,IVF Industrial Research and Development Corporation, Mölndal, Sweden, (2006)Google Search
45 
Laurila T., Vuorinen V., Kröckel M. P., Mater. Sci. Eng. R,68, 1 (2010)Google Search
46 
Rizvi M. J., Chan Y. C., Bailey C., Lu H., Islam M. N., J Alloys Compd,407, 208 (2006)Google Search
47 
Hodúlová E., Palcut M., Lechovič E., Šimeková B., Ulrich K., Alloys Compd,509, 7052 (2011)Google Search