The Journal of
the Korean Journal of Metals and Materials

The Journal of
the Korean Journal of Metals and Materials

Monthly
  • pISSN : 1738-8228
  • eISSN : 2288-8241

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2012-10

201210 (Vol.50, No.10)

P.785

A Flip Chip Process Using an Interlocking-Joint Structure Locally Surrounded by Non-conductive Adhesive

최정열(Jung Yeol Choi); 오태성(Tae Sung Oh)
https://doi.org/10.3365/KJMM.2012.50.10.785